Vol.27 No.4(1992.12)
Research Report

Studies on Ion Nitriding of Aluminum and Its Alloys

Hideo Tachikawa


Studies were made on low temperature ion nitriding of aluminum and its alloys by dc glow discharge in nitrogen atmosphere. Aluminum-nitride layers were formed on the surfaces of aluminum and its alloys even at temperatures as low as 450 as a result of argon sputtering prior to nitriding. In this ion nitriding process, not only formation of nitride layers but also sputtering of the formed nitride layers due to nitrogen ion bombardment proceeded simultaneously. The growth rate of the layers strongly depends on nitriding temperature and alloy elements. The sputtering rate depends on nitrogen pressure and glow discharge voltage. Magnesium and silicon in alloys increase the growth rate and titanium, vanadium, manganese, iron and nickel in alloys bring about strong adhesion between the layer and the substrate. Micro-vickers hardness of the layers ranged from HV1000 to HV1600, depending on the kind of alloys. The formed layers showed excellent resistance to wear compared with those of commercially available surface treating such as anodic oxidation, plasma sprays and electrodeposition. The nitriding provides improved corrosion resistance in 1N-HCl. The nitriding treatment can be operated with the apparatus which is similar to a conventional type for ion nitriding of steels.
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