Vol.29 No.2(1994.6)
Research Report

Photoelectrochemical deposition of copper and nickel on TiO₂ particles was investigated. The stable deposition of these metals on TiO₂ particles with irradiation was observed under the conditions that had not been reported previously. The deposition mechanism was investigated with ICP-AES, XRD, and other methods. It was clarified that the photoelectrochemical deposition of nickel occurs due to the quantum size effect of nano-scale TiO₂ fine particles. Combining this phenomenon with electroless plating technique, the titled new plating method has been developed. Compared to the conventional plating methods, the developed method has the following characteristics :

1) It does not require resists and Pd colloids that act as nuclei for the electroless plating reaction.

2) Metal patterns are formed by simple processes.

It is very difficult to form resist patterns on a substrate with a stepped or curved surface. Therefore, this method is more effective in forming metal patterns on the substrate. The application of this method to molded interconnection devices is expected.

�@